Electronics PCB Design and Output

To begin with, a PCB layer is created using a PCB design software by designers. Once the design is approved for production, the design is exported into a supportive format. A Design for Manufacturability test is run to ensure that the design fulfills the requirements for minimum tolerances. What follows next is the PCB printing process.

Printing the inner layers

The film is next printed onto a copper foil. The basic form of PCB is a laminate board whose core material is epoxy resin and glass fiber. The laminate serves as an ideal body for receiving the copper. The substrate material provides a sturdy and dust-resistant starting point for the PCB. Copper is pre-bonded on both sides. The process involves whittling away the copper to reveal the design from the films.

The copper –

sided laminate is cleaned and the clean panel receives the photo resist layer, which hardens after exposure to UV light. The light passes through the clear parts of the film, hardening the photo resist on the copper underneath. The areas not meant to harden are then slated for removal.

Removing the Unwanted Copper

A powerful chemical preparation is used to eat away the excess copper. While the exposed copper is removed, the desired copper remains protected beneath the layer of photo resist.

Layer Alignment and Optical Inspection

The inner layers are now aligned to the outer ones. With the help of an optical punch, holes are accurately punched. An Automatic Optical Inspection is carried out to ensure absence of defects. Once the stage of inspection is passed, the PCB moves to the final stages of production.

Layer-up and Bond

All the layers are now fused. A prepreg layer is placed over the alignment basin. The substrate layer fits over the prepreg before placing the copper sheet. More sheets of prepreg sit on top of the copper layer. Finally, an aluminum foil and copper press plate complete the stack. Now it’s prepped for pressing.

Drill

Holes are now are bored into the stack board. An x-ray locator identifies the drill target spots.

Plating and Copper Deposition

After drilling, the panel moves onto plating. The process fuses the different layers together using chemical deposition. After a thorough cleaning, the panel undergoes a series of chemical baths.

Outer Layer Imaging

Photo resist is once again applied and exposed to UV light. Finally, the outer plates undergo inspection to ensure all of the undesired photo resist was removed.

Plating

The panel is electroplated with a thin copper layer. Etching removes the unwanted copper foil from the panel.

Final Etching

The unwanted copper undergoes removal. The tin protects the copper during this stage.

Solder Mask Application

Panels are cleaned and solder mask applied to both sides and exposed to UV light. The covered portion remains unhardened and undergoes removal.

Surface Finish

The appropriate surface finish is added based on bespoke requirements and based on the environment under which the electronic product has to operate. At Mer-Mar Electronics, we have a wide range of surface finishes on offer.

Silkscreen

The vital information pertaining to the PCB is next written on the surface.

Electrical Testing

Electrical tests are next performed to check functionality. At Mer-Mar Electronics, we also perform the Flying Probe Test to test the electrical performance.

Profiling and V-Scoring

Boards are now cut from the original panel. This is done using a Router or V-Groove